Automotive
The current situation for automotive OEMs & Tier 1s.
Automotive OEMs are heavily reliant on Tier1 with architectural solutions, which often rely on general purpose off-the-shelf IC solutions. These silicon solutions are not optimised for a particular OEM. Leading to inefficiency and too costly solutions. This forces OEMs to start owning their own Electronics architecture.
Current Automotive market trends such as; electrification, autonomous driving, zonal architectures, and software-defined vehicles require customized hardware solutions for OEMs to stay competitive in the face of increasing competition.
Automotive OEMs (and Tier1s) lack the capabilities to analyse and develop multiple hardware solutions in house in a swift manner. online can make all the difference.
The ChipFlow Solution
ChipFlow enables Automotive OEMs to:
Swiftly analyse and test SW/HW concepts (FPGA) and progress the selected concepts to ASICs
Consolidate ICs & ECUs to reduce complexity and cost.
Simplify wiring harnesses and reduce material costs.
Gain agility to adapt to evolving market demands. Reduce dependence on costly & slow Tier1s suppliers.
Design chips to meet automotive safety standards, such as ISO26262.
ChipFlow offers a unique hardware/software co-design approach. With ChipFlow, Automotive OEMs (& Tier1s) can analyse SW/HW options and design chips that outperform competitors’ generic solutions by being optimized for their specific application requirements from the onset of the design.
ChipFlow specializes in consolidating and optimizing Remote I/O solutions within SDV (Software-Defined Vehicle) architectures. We assist OEMs and Tier 1 suppliers in managing SDV transformations by offering cost-effective turnkey hardware solutions, system-level design expertise, and tailored gateway designs. We enable consolidation of communication protocols such as Ethernet, CAN, and LIN, simplifying hardware complexity and reducing costs.
Book a demo
Find out how ChipFlow can help you today