Automotive

The current situation for automotive OEMs & Tier 1s.

  • Automotive OEMs are heavily reliant on Tier1 with architectural solutions, which often rely on general purpose off-the-shelf IC solutions. These silicon solutions are not optimised for a particular OEM. Leading to inefficiency and too costly solutions. This forces OEMs to start owning their own Electronics architecture. 

  • Current Automotive market trends such as; electrification, autonomous driving, zonal architectures, and software-defined vehicles require customized hardware solutions for OEMs to stay competitive in the face of increasing competition.

  • Automotive OEMs (and Tier1s) lack the capabilities to analyse and develop multiple hardware solutions in house in a swift manner. online can make all the difference.

The ChipFlow Solution

ChipFlow enables Automotive OEMs to: 

  • Swiftly analyse and test SW/HW concepts (FPGA) and progress the selected concepts to ASICs 

  • Consolidate ICs & ECUs to reduce complexity and cost.

  • Simplify wiring harnesses and reduce material costs.

  • Gain agility to adapt to evolving market demands. Reduce dependence on costly & slow Tier1s suppliers.

  • Design chips to meet automotive safety standards, such as ISO26262.

ChipFlow offers a unique hardware/software co-design approach. With ChipFlow, Automotive OEMs (& Tier1s) can analyse SW/HW options and design chips that outperform competitors’ generic solutions by being optimized for their specific application requirements from the onset of the design.

ChipFlow specializes in consolidating and optimizing Remote I/O solutions within SDV (Software-Defined Vehicle) architectures. We assist OEMs and Tier 1 suppliers in managing SDV transformations by offering cost-effective turnkey hardware solutions, system-level design expertise, and tailored gateway designs. We enable consolidation of communication protocols such as Ethernet, CAN, and LIN, simplifying hardware complexity and reducing costs.

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Find out how ChipFlow can help you today